Waterproof smartphones spreading, antenna market structure shaking
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Waterproof smartphones spreading, antenna market structure shaking
2014/02/12 By Lee Hyeong-soo
 


Antenna market structure is shaking as smartphones with waterproof and dustproof functions are spreading.

This is because in-mold antenna (IMA) technology, which was pushed out from the mainstream following the advent of laser direct structuring (LDS) method, started drawing attention again as it is known to be advantageous in waterproof and dustproof smartphone implementation.

IMA makers are aiming to reclaim smartphone market by developing not only waterproof and dustproof functions, but also products of high-frequency (RF) performances and small thickness.

According to the industry on the 11th, IMA demand is increasing rapidly as waterproof and dustproof smartphones are winning popularity as of late.

Scheduled to launch ¡®Galaxy S5,¡¯ Samsung Electronics, especially, cancelled an order for five million LDS rear case built-in antennas and made a shift to IMA technology. The company adjusted its parts supply plan as the forwarding volume of Galaxy S5 Series¡¯ waterproof and dustproof model increased from the initial plan.

In the past, waterproof and dustproof models were released in small numbers targeting a niche market. However, this function is forecast to position itself as a basic function for Samsung Electronics¡¯ premium smartphone models.

LDS antenna is created by engraving patterns with laser on a plastic frame and plating the frame with silver or copper. It provides excellent RF function and is advantageous in creating smartphone with a small thickness. LDS antenna is currently applied to most high-end smartphones.

The problem is that LDS antenna has a weak waterproof function because it is difficult to completely seal the joints between main board (HDI) and antenna attached to the rear case. IMA has an advantage in terms of waterproof function because it is structurally convenient to fill up gaps in circuit joints.

This is a reason for the recent rise of Samsung Electro-Mechanics and RFTech, Samsung Electronics¡¯ primary suppliers holding IMA technology. LG Electronics¡¯ suppliers, such as LS Mtron, have also embarked on IMA technology development, according to sources.

However, IMA must solve a number of issues before it can be settled as a mainstream in smartphone market beyond the niche market centering on waterproof and dustproof functions. Compared to LDS antenna, IMA is lower in RF function and is disadvantageous in realizing a small thickness.

Some IMA makers are developing products as advanced as LDS antenna using thin-film injection molding technology. Using this technology, Daesan Electronics developed a ¡®high-performance in-mold antenna (H-IMA)¡¯ that surpasses performance and thickness level of LDS antenna. The double-injection thickness of H-IMA is more than half that of the existing IMA products. The thickness of plastic layer covering antenna is only around 0.15 – 0.2mm. As a result, H-IMA produced RF performance greater than that of LDS antenna. When the antenna is inserted into a plastic case, the rear case of smartphone can be made thinner by 20% or more than the existing products. The key is whether or not the company can secure excellent mass-producibility.

¡°As press and injection molding technologies are gradually advancing, LDS antenna is facing a new challenge,¡± said an industry insider. ¡°We are keeping our eyes on the antenna market, expecting yet another technological competition in the market.¡±

Lee Hyeong-soo | goldlion2@etnews.com